Concepedia

Packaging Effects Characterization

Packaging Effects Characterization is a methodological framework in MEMS characterization that identifies and quantifies the influence of packaging-induced stresses, thermal mismatches, and environmental interactions on the performance, reliability, and operational stability of microelectromechanical systems.

46

Publications

1.2K

Citations

187

Authors

60

Institutions

Publications per year

2017–2026

2

Parents

Publications

46

Chip-packaging interaction: a critical concern for Cu/low k packaging

Guotao Wang, Paul S. Ho, Steven K. Groothuis · Microelectronics Reliability · 2005 · 109 citations

, , +15

Packaging Effect on MEMS Pressure Sensor Performance

Rudolf H. Krondorfer, Yeong K. Kim · IEEE Transactions on Components and Packaging Technologies · 2007 · 71 citations

, , +17

Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change

Jinwon Joo, Sung‐Hoon Choa · IEEE Transactions on Components and Packaging Technologies · 2007 · 64 citations

, , +16

Wafer-level MEMS packaging via thermally released metal-organic membranes

P. Monajemi, P. J. Amal Joseph, Paul A. Kohl et al. · Journal of Micromechanics and Microengineering · 2006 · 58 citations

, , +17

Experimental and Mathematical Determination of Mechanical Strains within Plastic IC Packages and Their Effect on Devices During Environmental Tests

R. J. Usell, S. A. Smiley · Reliability physics · 1981 · 56 citations

, , +16

1–5 of 46

Authors

187

  1. GK
    Gary K. Fedder

    Carnegie Mellon University, United States

    2 publications · 38 citations

    2

    h-index

  2. GV
    Geert Van der Plas

    IMEC, Belgium

    2 publications · 29 citations

    2

    h-index

  3. RP
    Ronald P. Luijten

    IBM Research - Zurich, Switzerland

    2 publications · 64 citations

    2

    h-index

  4. VC
    Victoria Caparrós Cabezas

    IBM Research - Zurich, Switzerland

    2 publications · 64 citations

    2

    h-index

  5. TM
    Tamal Mukherjee

    Carnegie Mellon University, United States

    2 publications · 38 citations

    2

    h-index

1–5 of 187

Institutions

60

  1. Texas Instruments (United States)

    Dallas, United States

    2 h-index

    7 publications

    103 citations

  2. Carnegie Mellon University

    Pittsburgh, United States

    2 h-index

    7 publications

    134 citations

  3. STMicroelectronics (Italy)

    Milan, Italy

    2 h-index

    2 publications

    65 citations

  4. IMEC

    Leuven, Belgium

    2 h-index

    20 publications

    275 citations

  5. Motorola (United States)

    Schaumburg, United States

    2 h-index

    3 publications

    33 citations

  6. Georgia Institute of Technology

    Atlanta, United States

    2 h-index

    5 publications

    303 citations

  7. KU Leuven

    Leuven, Belgium

    2 h-index

    4 publications

    63 citations

  8. The University of Texas at Austin

    Austin, United States

    2 h-index

    3 publications

    258 citations

1–8 of 60

Venues

  1. Microelectronics Reliability

    5 publications · 209 citations

    5

    h-index

  2. 2

    h-index

  3. Sensors and Actuators A Physical

    2 publications · 35 citations

    2

    h-index

  4. IMAPSource Proceedings

    1 publications · 11 citations

    1

    h-index

  5. Journal of Micromechanics and Microengineering

    JMM · 1 publications · 58 citations

    1

    h-index

1–5