Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps

Electromigration in integrated circuit conductors

J. R. Lloyd · Journal of Physics D Applied Physics · 1999 · 200 citations

Engineering, Electrical Engineering, Materials Science +16

In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

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Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface

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Natural Sciences, Materials Engineering, Materials Science +17

Electromigration-induced failure in flip-chip solder joints

Yuan Lin, Cheng‐Hsien Tsai, Yu Hu et al. · Journal of Electronic Materials · 2005 · 97 citations

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Effect of contact metallization on electromigration reliability of Pb-free solder joints

Min Ding, Guotao Wang, Brook Chao et al. · Journal of Applied Physics · 2006 · 80 citations

Natural Sciences, Materials Engineering, Materials Science +16