Procedia Engineering · 2011 · 13 citations · 11 references
Natural SciencesMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsMetallic MaterialsMetallurgyAlloysMetalsPhysical MetallurgyStrengthening MechanismsFractographyInterfacial MicrostructureJoint Shear StrengthMicrostructureShear Strength AnalysisShear Strength ReductionSolder Joint StrengthSoldering
Effect of zinc addition on the shear property evolution between Sn-0.7Cu solder alloy and their joints reflowed at 250 °C was investigated. The shear strength of Sn-0.7Cu/Cu joint was found to be higher than of Sn-0.7Cu solder alloy. Although a small addition of zinc element strengthened Sn-0.7Cu solder alloy, it decreased the shear strength of Sn- 0.7Cu solder joints. Based on the fractography analysis and interfacial microstructure observation, it is proposed that the deposition of Cu-Zn intermetallic toward the interface during reflowing is largely responsible for the shear property evolution between the Sn-0.7Cu solder alloy and their joints.
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Pb-free solders for flip-chip interconnects
D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 317 citations
Engineering, Electrical Engineering, Materials Engineering +14
Growth kinetics of intermetallic compounds in chip scale package solder joint
P.L. Tu, Y.C. Chan, K.C. Hung et al. · Scripta Materialia · 2001 · 140 citations
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Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface
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Natural Sciences, Materials Engineering, Materials Science +12