Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface - Concepedia

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Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface

116

Citations

20

References

2003

Year

Xin Ma, Fengjiang Wang, Yiyu Qian, Fusahito YOSHIDA

Materials Letters

Materials ScienceEngineeringMechanical EngineeringCu–sn Intermetallic CompoundElectronic Packaging

References

	Year	Citations

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