Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

Engineering, Materials Engineering, Materials Science +9

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Cohesion in metals

F.R. de Boer, W.C.M. Mattens, R. Boom et al. · 1988 · 1.3K citations

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H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14