Yiyu Qian - Concepedia

Author

Yiyu Qian

Harbin Institute of Technology ORCID

Also Known As

Y. Y. Qian, Y.Y Qian, Y.Y. Qian, Yi-Yu Qian, Yi-yu QIAN, Yigang QIAN, Yiyu Qian, Yongjin Qian, Yuwangxuan Qian

Publications

998

Citations

H-Index

Concepts

All Affiliations

Harbin Institute of Technology The University of Osaka University of Kentucky Hiroshima University South China University of Technology

About

Yiyu Qian is an author at Harbin Institute of Technology specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	21	927
2	Materials Engineering	14	16	688
3	Applied Physics	8	8	268
4	Chemical Engineering	3	3	80
5	Chemistry	1	1	26

Yiyu Qian

Publications

927

Citations

H-Index

Page 1

	Year	Citations
Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface Xin Ma, Fengjiang Wang, Yiyu Qian, Materials Letters Materials ScienceEngineeringMechanical EngineeringCu–sn Intermetallic CompoundElectronic Packaging	2003	116
Effect of La on the Cu–Sn intermetallic compound (IMC) growth and solder joint reliability Xin Ma, Yiyu Qian, Fusahito YOSHIDA Journal of Alloys and Compounds Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringCu–sn Intermetallic Compound	2002	110
Microstructure and strength of diffusion-bonded joints of TiAl base alloy to steel Peng He, J.C. Feng, B.G Zhang, Materials Characterization Materials EngineeringMaterials ScienceFriction WeldingEngineeringCorrosion	2002	78
Multi-objective optimization for materials design with improved NSGA-II Peng Zhang, Yiyu Qian, Quan Qian Materials Today Communications Materials EngineeringEngineeringMaterial SelectionMaterials OptimizationMulti-objective Optimization	2021	76
The formation of a single-pulse electrospark deposition spot Jun Liu, Ruijun Wang, Yiyu Qian Surface and Coatings Technology EngineeringPhysicsSurface ScienceApplied PhysicsVacuum Device	2004	58
Structural and interfacial analysis of WC92–Co8 coating deposited on titanium alloy by electrospark deposition R. J. Wang, Yiyu Qian, Jun Liu Applied Surface Science Materials EngineeringMaterials ScienceElectrospark DepositionEngineeringMechanical Engineering	2004	56
Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging Fengjiang Wang, Feng Gao, Xin Ma, Journal of Electronic Materials Materials ScienceMaterials EngineeringCu SubstrateEngineeringCorrosion	2006	56
A new technology for diffusion bonding intermetallic TiAl to steel with composite barrier layers Peng He, J.C. Feng, B.G. Zhang, Materials Characterization Materials EngineeringMaterials ScienceNew TechnologyEngineeringSuperalloy	2003	55
Reactive wetting of Sn0.7Cu–xZn lead-free solders on Cu substrate Hongqin Wang, Fengjiang Wang, Feng Gao, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceEngineeringSurface ScienceElectronic Packaging	2006	48
Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance Hongqin Wang, Feng Gao, Xin Ma, Scripta Materialia Materials EngineeringMaterials ScienceChemical EngineeringEngineeringCorrosion	2006	39

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