Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount of Zn addition - Concepedia

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Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount of Zn addition

106

Citations

10

References

2005

Year

Fan Wang, Xinqing Ma, Ying Qian

Scripta Materialia

Materials ScienceMaterials EngineeringEutectic Sn–0.7cu SolderEngineeringApplied PhysicsElectronic PackagingZn AdditionInterface StructureMicrostructure

References

	Year	Citations

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