Japanese Journal of Applied Physics · 2009 · 174 citations · 19 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDefects In Electronic MaterialsDevice ModelingOxide SemiconductorsSemiconductor DefectsSemiconductor PhysicsThin-film TransistorsActivation EnergyAmorphous SiliconAmorphous Silicon Thin-film TransistorsDefect Formation EnergyHydrogenated Amorphous SiliconPoint DefectsThreshold VoltageTransfer Characteristics
The transfer characteristics of amorphous InGaZnO4 thin-film transistors (a-IGZO TFTs) were measured at temperatures ranging from 298 to 523 K in order to analyze the behavior of the above-threshold (ON state) and subthreshold regions. For comparison, the transfer characteristics of a hydrogenated amorphous silicon TFT (a-Si:H TFT) were measured in the same temperature range. We developed a simple analytical model that relates the threshold voltage (Vt) decrease due to increasing temperature to the formation of point defects in a-IGZO. It is well known that the formation of point defects results in the generation of free carriers in oxide semiconductors. Incorporating the analytical model with the experimental transfer characteristics data taken at high temperatures over 423 K, we estimated the formation energy to be approximately 1.05 eV. The Vt decrease because of the generation of point defects is peculiar to a-IGZO TFTs, which is not observed in a-Si:H TFTs. The results for the ON-current activation energy suggested that the density of tail states for a-IGZO is much lower than that for a-Si:H.
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