Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures

Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures

Meint J. de Boer, Henri Jansen, Edwin Smulders et al. · Journal of Microelectromechanical Systems · 2002 · 264 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Micromachining of buried micro channels in silicon

Meint J. de Boer, R.W. Tjerkstra, Henri Jansen et al. · Journal of Microelectromechanical Systems · 2000 · 185 citations · Full text

Engineering, Electrical Engineering, Microelectronics +16

SCREAM MicroElectroMechanical Systems

Noel C. MacDonald · Microelectronic Engineering · 1996 · 101 citations · Full text

Engineering, Materials Engineering, Materials Science +17

The MEMSNAS Process: Microloading Effect for Micromachining 3-D Structures of Nearly All Shapes

Tarik Bourouina, T. Masuzawa, Hiroyuki Fujita · Journal of Microelectromechanical Systems · 2004 · 74 citations

Engineering, Manufacturing Engineering, Microelectromechanical Systems +12

Cryogenic dry etching for high aspect ratio microstructures

K. Murakami, Yoshihiro Wakabayashi, Kazuyuki MINAMI et al. · 2002 · 41 citations

Engineering, Materials Engineering, Materials Science +15