Journal of The Electrochemical Society · 2001 · 36 citations · 19 references
EngineeringElectrical EngineeringMaterials EngineeringMicroelectronicsSemiconductor DevicesSemiconductor MaterialsMetal-oxide-semiconductor Field-effect TransistorsSemiconductor InterfacesSemiconductor PhysicsWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsBreakdown VoltageDepletion-mode TransistorsGallium NitrideGate LeakageGate Leakage CurrentGate Oxide LeakageGate OxidesTransconductance
GaN-based metal oxide semiconductor field effect transistors (MOSFETs) were demonstrated using a stacked gate oxide consisting of single-crystal and amorphous provides a good oxide/semiconductor interface and reduces the gate leakage current and enhances oxide breakdown voltage. Charge modulation of the n-channel depletion mode MOSFET was achieved for gate voltage from +2 to −4 V. The source-drain breakdown voltage exceeded 80 V. An intrinsic transconductance of 61 mS/mm was obtained at a gate-source and drain-source bias of −0.5 and 20 V, respectively. This is the first demonstration of epitaxial growth on GaN and the first use of as an insulating layer for nitride electronic device applications. © 2001 The Electrochemical Society. All rights reserved.
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GaN: Processing, defects, and devices
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Natural Sciences, Electrical Engineering, Materials Science +17
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