Al$_{2}$O$_{3}$ Growth on (100) In$_{0.53}$Ga$_{0.47}$As Initiated by Cyclic Trimethylaluminum and Hydrogen Plasma Exposures

Abstract

The influence of hydrogen plasma treatment before atomic layer deposition of aluminum oxide on In0.53Ga0.47As is investigated. Experiments on untreated, trimethylaluminum-treated, hydrogen-plasma treated, and iterative hydrogen plasma/trimethylaluminum-treated samples are compared in the context of interface trap density, Dit. Through the conductance method, it was found that five cycles of two s, 20 mT, 100 W hydrogen plasma alternating with 40 msS of trimethylaluminum dose prior to dielectric growth resulted in a reduction of interface trap density (0.2 eV below the conduction band edge) from 4.6×1012 eV-1 cm-2 for untreated samples to 1.7×1012 eV-1 cm-2 for treated samples.