2003 · 14 citations · 7 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDelay ModelingDevice CharacterizationDevice ModelingField-effect TransistorsTiming AnalysisTiming ModelingGallium Nitride (Gan) MaterialsMaskingMasking EffectsTotal Resistance
Performed a thorough transistor delay analysis on 0.2 /spl mu/m AlGaN/GaN HFETs implemented on sapphire substrates to identify the various contributions to the total transistor delay 1/2/spl pi/f/sub T/ = /spl tau//sub T/ as a function of gate-drain separation L/sub GD/. We found that the main delay component depends linearly upon the total access resistance of the source and drain regions determined from 'COLDFET' S-parameter measurements, indicating the contribution of extrinsic regions to the transistor delay cannot be neglected for AlGaN/GaN HFETs. Stripping the masking effects of the R/sub S/ and R/sub D/ series resistances reveals an effective channel velocity of /spl sim/3.3 /spl times/ 10/sup 7/ cm/s which is much higher than the values of 1.2-1.3 /spl times/ 10/sup 7/ cm/s generally inferred from f/sub T/ data, but in excellent agreement with predictions from Monte Carlo transport simulations. We also show that process-specific details for devices fabricated on the same epitaxial layers affect the f/sub T/(L/sub GD/) dependence.
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Undoped AlGaN/GaN HEMTs for microwave power amplification
L.F. Eastman, V. Tilak, J. Smart et al. · IEEE Transactions on Electron Devices · 2001 · 389 citations