Resist Development

Resist Development is a microfabrication process in thin-film patterning that belongs to the class of lithographic techniques and is specifically distinguished by the selective removal of exposed or unexposed regions of a photosensitive resist layer following radiation exposure, thereby transferring the desired pattern into the resist for subsequent etching or deposition steps.

351

Publications

10.4K

Citations

1.2K

Authors

239

Institutions

Publications per year

2017–2026

22

Authors

1.2K

  1. TK
    Takahiro Kozawa

    The University of Osaka, Japan

    15 publications · 579 citations

    14

    h-index

  2. TI
    Toshiro Itani

    The University of Osaka, Japan

    12 publications · 377 citations

    11

    h-index

  3. CG
    C. Grant Willson

    The University of Texas at Austin, United States

    10 publications · 246 citations

    10

    h-index

  4. TH
    Theodore H. Fedynyshyn

    MIT Lincoln Laboratory, United States

    8 publications · 119 citations

    8

    h-index

  5. ST
    Seiichi Tagawa

    The University of Osaka, Japan

    8 publications · 281 citations

    8

    h-index

1–5 of 1.2K

Venues

  1. 24

    h-index

  2. 22

    h-index

  3. Japanese Journal of Applied Physics

    JJAP · 26 publications · 1.1K citations

    15

    h-index

  4. Journal of Photopolymer Science and Technology

    29 publications · 564 citations

    14

    h-index

  5. Microelectronic Engineering

    19 publications · 401 citations

    13

    h-index

1–5