Concepedia

Package Miniaturization

Package Miniaturization is a BioMEMS packaging strategy that reduces the physical dimensions of the device enclosure while maintaining or enhancing functional performance, reliability, and biocompatibility, distinguishing it from conventional packaging approaches through its emphasis on dimensional scalability and integration density for implantable or point-of-care applications.

25

Publications

853

Citations

122

Authors

28

Institutions

Publications per year

2017–2026

5

Parents

Publications

25

Miniature curved artificial compound eyes

Dario Floreano, Ramón Pericet-Cámara, Stéphane Viollet et al. · Proceedings of the National Academy of Sciences · 2013 · 351 citations · Full text

, , +12

Moore's law meets its match (system-on-package)

Rao Tummala · IEEE Spectrum · 2006 · 82 citations

, , +17

Die Attach Film Application in Multi Die Stack Package

Seunghyun Song, HB Tan, P.L. Ong · 2006 · 34 citations

, , +16

Immense Power in a Tiny Package: Wearables Based on Electrical Muscle Stimulation

Pedro Lopes, Patrick Baudisch · IEEE Pervasive Computing · 2017 · 34 citations

, , +13

Development of a Multi-project Fan-Out Wafer Level Packaging Platform

Tanja Braun, S. Raatz, Marius van Dijk et al. · 2017 · 32 citations

, , +16

1–5 of 25

Authors

122

  1. RA
    R. Aschenbrenner

    Fraunhofer Institute for Reliability and Microintegration, Germany

    4 publications · 85 citations

    4

    h-index

  2. TB
    Tanja Braun

    Fraunhofer Institute for Reliability and Microintegration, Germany

    4 publications · 85 citations

    4

    h-index

  3. SV
    S. Voges

    Fraunhofer Institute for Reliability and Microintegration, Germany

    3 publications · 69 citations

    3

    h-index

  4. KB
    Karl‐Friedrich Becker

    Technical University of Munich, Germany

    3 publications · 53 citations

    3

    h-index

  5. MJ
    Michael J. Topper

    Fraunhofer Institute for Reliability and Microintegration, Germany

    3 publications · 62 citations

    3

    h-index

1–5 of 122

Institutions

28

  1. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    4 h-index

    28 publications

    620 citations

  2. Technische Universität Berlin

    Berlin, Germany

    4 h-index

    13 publications

    294 citations

  3. Siliconware Precision Industries (Taiwan)

    Taichung, Taiwan

    2 h-index

    18 publications

    258 citations

  4. Fraunhofer-Gesellschaft

    Munich, Germany

    1 h-index

    2 publications

    702 citations

  5. Vestfold University College

    Tønsberg, Norway

    1 h-index

    6 publications

    66 citations

  6. Centre de physique des particules de Marseille

    Marseille, France

    1 h-index

    1 publications

    351 citations

  7. University of Oslo

    Oslo, Norway

    1 h-index

    6 publications

    66 citations

  8. University of Michigan

    Ann Arbor, United States

    1 h-index

    2 publications

    46 citations

1–8 of 28

Venues

  1. Johns Hopkins APL technical digest

    1 publications · 14 citations

    1

    h-index

  2. Medical & Biological Engineering & Computing

    1 publications · 22 citations

    1

    h-index

  3. IEEE Spectrum

    1 publications · 82 citations

    1

    h-index

  4. Proceedings of the National Academy of Sciences

    PNAS · 1 publications · 351 citations

    1

    h-index

  5. IEEE Pervasive Computing

    1 publications · 34 citations

    1

    h-index

1–5