Statistics
Publications
1
Citations
34
H-Index
1
Active since
2006
P.L. Ong is an author specializing in die-to-wafer bonding, die design, and adhesive bonding.
Publications per year
2006–2006
1
1
Die Attach Film Application in Multi Die Stack Package
Seunghyun Song, HB Tan, P.L. Ong · 2006 · 34 citations
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