Concepedia

Package Aging

Package Aging is a validation process in sterile packaging that assesses the integrity and microbial barrier properties of packaged medical devices over time under specified storage conditions to ensure sustained sterility.

14

Publications

477

Citations

60

Authors

17

Institutions

Publications per year

2017–2026

5

Variants

Sterile Barrier Aging

Parents

Publications

14

Error analysis of aged modules with cracked polyamide backsheets

Gabriele C. Eder, Yuliya Voronko, Gernot Oreški et al. · Solar Energy Materials and Solar Cells · 2019 · 89 citations

, , +13

Influence of temperature and humidity on adhesion of underfills for flip chip packaging

Shuchang Luo, C.P. Wong · IEEE Transactions on Components and Packaging Technologies · 2005 · 84 citations

, , +14

Interactions between solder and metallization during long-term aging of advanced microelectronic packages

Cheng–En Ho, W. T. Chen, C. R. Kao · Journal of Electronic Materials · 2001 · 64 citations

, , +14

Effects of Different Moisture-Permeable Packaging on the Quality of Aging Beef Compared with Wet Aging and Dry Aging

Yingwu Shi, Wangang Zhang, Guanghong Zhou · Foods · 2020 · 49 citations · Full text

, , +16

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

S. W. Ricky Lee, Y Tsui, Xingjia Hunag et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 2002 · 29 citations

, , +17

1–5 of 14

Authors

60

  1. CW
    C.P. Wong

    Georgia Institute of Technology, United States

    3 publications · 107 citations

    3

    h-index

  2. SL
    Shuaibing Li

    Lanzhou Jiaotong University, China

    1 publications · 23 citations

    1

    h-index

  3. SL
    Shijian Luo

    Georgia Institute of Technology, United States

    1 publications · 10 citations

    1

    h-index

  4. GC
    Gabriele C. Eder

    Österreichisches Forschungsinstitut für Chemie und Technik, Austria

    1 publications · 89 citations

    1

    h-index

  5. KN
    K. Najafi

    University of Michigan, United States

    1 publications · 21 citations

    1

    h-index

1–5 of 60

Institutions

17

  1. Georgia Institute of Technology

    Atlanta, United States

    2 h-index

    3 publications

    104 citations

  2. Lanzhou Jiaotong University

    Lanzhou, China

    1 h-index

    7 publications

    161 citations

  3. Polymer Competence Center Leoben (Austria)

    Leoben, Austria

    1 h-index

    3 publications

    267 citations

  4. The University of Sydney

    Sydney, Australia

    1 h-index

    1 publications

    11 citations

  5. Hong Kong University of Science and Technology

    Hong Kong, Hong Kong

    1 h-index

    4 publications

    116 citations

  6. National Central University

    Taoyuan City, Taiwan

    1 h-index

    3 publications

    192 citations

  7. University of Michigan

    Ann Arbor, United States

    1 h-index

    4 publications

    84 citations

  8. Gansu Great Wall Electrical and Electronics Engineering Research Institute

    Tianshui, China

    1 h-index

    3 publications

    69 citations

1–8 of 17

Venues

  1. 2

    h-index

  2. Journal of Power Sources

    1 publications · 20 citations

    1

    h-index

  3. Microelectronics Reliability

    1 publications · 13 citations

    1

    h-index

  4. Solar Energy Materials and Solar Cells

    1 publications · 89 citations

    1

    h-index

  5. Biomaterials

    1 publications · 23 citations

    1

    h-index

1–5