Interactions between solder and metallization during long-term aging of advanced microelectronic packages

Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

Cheng–En Ho, Ruixiao Zheng, Gan Luo et al. · Journal of Electronic Materials · 2000 · 121 citations

Natural Sciences, Materials Engineering, Materials Science +16

Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging

Andrew M. Minor, J. W. Morris · Metallurgical and Materials Transactions A · 2000 · 84 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +11

Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

Cheng–En Ho, Y. M. Chen, C. R. Kao · Journal of Electronic Materials · 1999 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +16

Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization

Andrew M. Minor, J. W. Morris · Journal of Electronic Materials · 2000 · 66 citations

Natural Sciences, Materials Engineering, Materials Science +12

Microstructures and mechanical properties of aging materials

Peter K. Liaw, R. Viswanathan, K.L. Murty et al. · 1993 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +17