Concepedia

Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization

Andrew M. Minor, J. W. Morris

Journal of Electronic Materials · 2000 · 66 citations · 5 references

DOI

Concepts

References

5

Fast dissolution and soldering reactions on Au foils

P. G. Kim, K. N. Tu · Materials Chemistry and Physics · 1998 · 88 citations

, , +12

Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging

Andrew M. Minor, J. W. Morris · Metallurgical and Materials Transactions A · 2000 · 84 citations · Full text

, , +11

Morphology of wetting reaction of eutectic SnPb solder on Au foils

P. G. Kim, K. N. Tu · Journal of Applied Physics · 1996 · 75 citations

, , +17

Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints

Y.C. Chan, P.L. Tu, A.C.K. So et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 67 citations

, , +17

The Au-Pb-Sn ternary system

A. Prince · Journal of the Less Common Metals · 1967 · 30 citations

, , +9