Mask Selectivity
Mask selectivity is the ratio of the etch rate of the underlying substrate material to the etch rate of the masking material, serving as a critical metric that quantifies the relative resistance of the mask to the etchant compared to the material being etched in semiconductor fabrication processes.
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1.6K
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203
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62
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2017–2026
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G. DeSalvo, Wen Feng Tseng, J. Comas · Journal of The Electrochemical Society · 1992 · 168 citations
Yung‐Jr Hung, San‐Liang Lee, B.J. Thibeault et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2010 · 59 citations
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Samsung (South Korea)
Seoul, South Korea
4 h-index
14 publications
332 citations
Intel (United States)
Santa Clara, United States
3 h-index
10 publications
151 citations
Sungkyunkwan University
Seoul, South Korea
3 h-index
10 publications
270 citations

Ajou University
Suwon, South Korea
2 h-index
2 publications
47 citations
Hitachi (Japan)
Tokyo, Japan
2 h-index
10 publications
312 citations
Seoul National University
Seoul, South Korea
2 h-index
8 publications
201 citations
École Polytechnique Fédérale de Lausanne
Lausanne, Switzerland
2 h-index
10 publications
400 citations
University of Michigan
Ann Arbor, United States
2 h-index
12 publications
196 citations
1–8 of 62
11 publications · 345 citations
10
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8 publications · 126 citations
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JJAP · 5 publications · 133 citations
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JES · 4 publications · 269 citations
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4 publications · 123 citations
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