Kevin J. Owen

Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process

Yemin Tang, A Sandoughsaz, Kevin J. Owen et al. · Journal of Microelectromechanical Systems · 2018 · 80 citations

Engineering, Electron-beam Lithography, Long Drie Process +19

High aspect ratio deep silicon etching

Kevin J. Owen, B. VanDerElzen, Rebecca L. Peterson et al. · 2012 · 51 citations

Reduced Undercut, Electrical Engineering, Wafer Scale Processing +13

Chlorine-based inductive coupled plasma etching of <i>α</i> -Ga ₂ O ₃

Zhe Jian, Yuichi Oshima, S. P. Wright et al. · Semiconductor Science and Technology · 2019 · 17 citations

Drie of fused silica

Zongliang Cao, B. VanDerElzen, Kevin J. Owen et al. · 2013 · 16 citations

Materials Science, Thixotropy, Engineering +10