A Sandoughsaz

Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process

Yemin Tang, A Sandoughsaz, Kevin J. Owen et al. · Journal of Microelectromechanical Systems · 2018 · 80 citations

Engineering, Electron-beam Lithography, Long Drie Process +19

Three-dimensional etching of silicon substrates using a modified deep reactive ion etching technique

S. Azimi, A Sandoughsaz, Babak Amirsolaimani et al. · Journal of Micromechanics and Microengineering · 2011 · 30 citations

Engineering, Silicon Substrates, Integrated Circuits +26

A novel non-sequential hydrogen-pulsed deep reactive ion etching of silicon

Milad Gharooni, A Mohajerzadeh, A Sandoughsaz et al. · Journal of Micromechanics and Microengineering · 2013 · 15 citations

Electrical Engineering, Ion Implantation, Engineering +13

Ultra high aspect-ratio and thick deep silicon etching (UDRIE)

Yemin Tang, A Sandoughsaz, Khalil Najafi · 2017 · 15 citations

Electrical Engineering, Wafer Scale Processing, Engineering +14

Realization of complex three-dimensional free-standing structures on silicon substrates using controllable underetching in a deep reactive ion etching

A Sandoughsaz, S. Azimi, H Mazreati et al. · Journal of Micromechanics and Microengineering · 2013 · 13 citations

Engineering, Surface Micromachining, Silicon Substrates +19