Guihai Luo

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Applied Surface Science · 2014 · 126 citations

Materials Science, Materials Engineering, Chemical Engineering +13

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Surface and Coatings Technology · 2014 · 123 citations

Materials Science, Materials Engineering, Chemical Engineering +12

Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Tribology International · 2015 · 111 citations

Materials Science, Materials Engineering, Sic Wafers +10

Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Guoshun Pan, Yan Zhou, Guihai Luo et al. · Journal of Materials Science Materials in Electronics · 2013 · 82 citations

Materials Science, Materials Engineering, Wafer Scale Processing +12

Fe-Nx/C assisted chemical–mechanical polishing for improving the removal rate of sapphire

Li Xu, Chunli Zou, Xiao‐Lei Shi et al. · Applied Surface Science · 2015 · 55 citations

Materials Science, Materials Engineering, Chemical Engineering +9