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XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Materials ScienceMaterials EngineeringChemical EngineeringEngineeringSi-face SicMaterial ProcessingSurface AnalysisMaterials CharacterizationApplied PhysicsSurface ScienceRemoval MechanismsSemiconductor Device FabricationChemical Mechanical PolishingSurface PolishingSurface ProcessingCarbide