Guoshun Pan

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Applied Surface Science · 2014 · 135 citations

Natural Sciences, Materials Engineering, Materials Science +17

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Surface and Coatings Technology · 2014 · 134 citations

Engineering, Materials Engineering, Materials Science +16

Surface modulation to enhance chemical mechanical polishing performance of sliced silicon carbide Si-face

Gaopan Chen, Jianguo Li, Jiangyou Long et al. · Applied Surface Science · 2020 · 74 citations

Engineering, Materials Engineering, Materials Science +14

Characterization of sapphire chemical mechanical polishing performances using silica with different sizes and their removal mechanisms

Yan Zhou, Guoshun Pan, Hua Gong et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2016 · 69 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +11

Achieving ultralow surface roughness and high material removal rate in fused silica via a novel acid SiO2 slurry and its chemical-mechanical polishing mechanism

Xiao‐Lei Shi, Gaopan Chen, Li Xu et al. · Applied Surface Science · 2019 · 53 citations · Full text

Engineering, Materials Engineering, Materials Science +17