Guoshun Pan

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Applied Surface Science · 2014 · 126 citations

Materials Science, Materials Engineering, Chemical Engineering +13

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Surface and Coatings Technology · 2014 · 123 citations

Materials Science, Materials Engineering, Chemical Engineering +12

Surface modulation to enhance chemical mechanical polishing performance of sliced silicon carbide Si-face

Gaopan Chen, Jianguo Li, Jiangyou Long et al. · Applied Surface Science · 2020 · 71 citations

Materials Science, Materials Engineering, Chemical Engineering +11

Characterization of sapphire chemical mechanical polishing performances using silica with different sizes and their removal mechanisms

Yan Zhou, Guoshun Pan, Hua Gong et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2016 · 64 citations

Materials Science, Materials Engineering, Chemical Engineering +13

Achieving ultralow surface roughness and high material removal rate in fused silica via a novel acid SiO2 slurry and its chemical-mechanical polishing mechanism

Xiao‐Lei Shi, Gaopan Chen, Li Xu et al. · Applied Surface Science · 2019 · 51 citations

Materials Science, Molecular Sieve, Chemical Engineering +9