Hua Gong

Monitoring of the central blood pressure waveform via a conformal ultrasonic device

Chonghe Wang, Xiaoshi Li, Hongjie Hu et al. · Nature Biomedical Engineering · 2018 · 878 citations · Full text

Medicine, Physics, Physiology +14

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Applied Surface Science · 2014 · 135 citations

Natural Sciences, Materials Engineering, Materials Science +17

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Surface and Coatings Technology · 2014 · 134 citations

Engineering, Materials Engineering, Materials Science +16

Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi et al. · Tribology International · 2015 · 112 citations

Engineering, Materials Engineering, Materials Science +16

Characterization of colloidal silica abrasives with different sizes and their chemical–mechanical polishing performance on 4H-SiC (0001)

Xiao‐Lei Shi, Guoshun Pan, Yan Zhou et al. · Applied Surface Science · 2014 · 105 citations

Natural Sciences, Materials Engineering, Materials Science +15