Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

Yan Zhou, Guoshun Pan, Xiao‐Lei Shi, +3

Tribology International

Materials ScienceMaterials EngineeringSic WafersSurface CharacterizationEngineering +8

Characterization of colloidal silica abrasives with different sizes and their chemical–mechanical polishing performance on 4H-SiC (0001)

Xiao‐Lei Shi, Guoshun Pan, Yan Zhou, +3

Applied Surface Science

Materials EngineeringMaterials ScienceChemical EngineeringEngineeringCeramic Material +10

Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrate

Wenhu Xu, Xinchun Lu, Guoshun Pan, +2

Applied Surface Science

Materials ScienceUltrasonic Flexural VibrationEngineeringMaterial ProcessingMicrofabrication +6

Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Guoshun Pan, Yan Zhou, Guihai Luo, +3

Journal of Materials Science Materials in Electronics

Materials ScienceMaterials EngineeringWafer Scale ProcessingEngineeringMicrofabrication +10

A study of chemical products formed on sapphire (0001) during chemical–mechanical polishing

Xiao‐Lei Shi, Guoshun Pan, Yan Zhou, +3

Surface and Coatings Technology

Materials ScienceChemical EngineeringEngineeringMaterial ProcessingSurface Science +8

Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

Wenhu Xu, Xinchun Lu, Guoshun Pan, +2

Applied Surface Science

Materials ScienceUltrasonic Flexural VibrationEngineeringMaterial ProcessingMicrofabrication +8

Femtosecond laser modification of silicon carbide substrates and its influence on CMP process

Xiaozhu Xie, Qingfa Peng, Gaopan Chen, +3

Ceramics International

Materials ScienceAdvanced Laser ProcessingEngineeringLaser Micro-processingFemtosecond Laser Modification +9

Atomically smooth gallium nitride surface prepared by chemical-mechanical polishing with S2O82−-Fe2+ based slurry

Xiao‐Lei Shi, Chunli Zou, Guoshun Pan, +3

Tribology International

Materials ScienceSurface CharacterizationEngineeringSurface ScienceApplied Physics +5

Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances

Guoshun Pan, Zhonghua Gu, Yan Zhou, +3

Wear

Materials ScienceMaterials EngineeringChemical EngineeringSio2 Abrasive ParticlesEngineering +9

Effect of photocatalytic oxidation technology on GaN CMP

Jie Wang, Tongqing Wang, Guoshun Pan, +1

Applied Surface Science

Chemical EngineeringEngineeringPhotochemistryGan CmpGan Power Device +4