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Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Materials ScienceMaterials EngineeringWafer Scale ProcessingEngineeringMicrofabricationFlat Defect-free SurfaceMechanical EngineeringApplied PhysicsSurface ScienceSurface EngineeringSemiconductor Device FabricationChemical Mechanical PolishingSurface PolishingSurface ProcessingMicrostructure