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Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

Materials ScienceMaterials EngineeringSic WafersSurface CharacterizationEngineeringMaterial ProcessingMechanical EngineeringApplied PhysicsSurface ScienceChemical Mechanical PolishingSurface PolishingSurface ProcessingMicrostructure