C.C. Wei - Concepedia

Author

C.C. Wei

Texas Instruments (United States)

Also Known As

C. C. Wei, C. Wei, C.-C. Wei, C.C. Wei, Che-Chia Wei, Chung-Tai Wei, Chunting Wei, chunyu wei

Publications

542

Citations

H-Index

Concepts

All Affiliations

Texas Instruments (United States)

About

C.C. Wei is an author at Texas Instruments (United States) specializing in engineering, applied physics, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	422
2	Applied Physics	7	7	395
3	Electrical Engineering	7	7	409
4	Computer Engineering	4	4	154
5	Materials Engineering	2	2	28

C.C. Wei

Publications

500

Citations

H-Index

Page 1

	Year	Citations
Single-transistor latch in SOI MOSFETs C.-D. Chen, M. Matloubian, R. Sundaresan, IEEE Electron Device Letters Positive FeedbackElectrical EngineeringEngineeringSingle-transistor LatchStress-induced Leakage Current	1988	192
Titanium disilicide contact resistivity and its impact on 1-&#181;m CMOS circuit performance D.B. Scott, R. A. Chapman, C.C. Wei, IEEE Transactions on Electron Devices	1987	78
Hot-carrier induced electron mobility and series resistance degradation in LDD NMOSFET's Yutao Pan, K.K. Ng, C.C. Wei IEEE Electron Device Letters EngineeringSeries Resistant DriftElectron MobilitySeries Resistance DegradationSemiconductor Device	1994	48
0.5 micron CMOS for high performance at 3.3 V R. A. Chapman, C.C. Wei, David A. Bell, EngineeringVlsi DesignComputer ArchitectureIntegrated CircuitsDesign Length	2003	47
Titanium nitride local interconnect technology for VLSI T.E. Tang, C.C. Wei, R.A. Haken, IEEE Transactions on Electron Devices EngineeringVlsi DesignIntegrated CircuitsSilicon On InsulatorInterconnect (Integrated Circuits)	1987	44
An 0.8&amp;#181;m CMOS technology for high performance logic applications R. A. Chapman, R.A. Haken, David A. Bell, Electrical EngineeringEngineeringVlsi DesignHigh-speed ElectronicsDevice Integration	1987	36
An 8 ns BiCMOS 1 Mb ECL SRAM with a configurable memory array size Hoang Vinh Tran, K. Fung, David A. Bell, EngineeringVlsi DesignMemory DesignEmerging Memory TechnologyComputer Architecture	2003	27
Planarized aluminum metallization for sub-0.5 mu m CMOS technology F.S. Chen, Yi Lin, Girish Dixit, EngineeringConventional Sputtering SystemIntegrated CircuitsThin Film Process TechnologyAl-plug Process	2002	15
Reactively sputtered titanium nitride films for submicron contact barrier metallization Girish Dixit, C.C. Wei, F.T. Liou, Applied Physics Letters EngineeringCubic Boron NitrideBarrier MetalBoron NitrideThin Film Processing	1993	13

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