Mike Ma

High-Density Hybrid Substrate for Heterogeneous Integration

Tony Peng, John H. Lau, Cheng-Ta Ko et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 22 citations

Engineering, Materials Engineering, Materials Science +17

The Development and the Integration of the 5 µm to 1 µm Half Pitches Wafer Level Cu Redistribution Layers

Mike Ma, Stephen Chen, Po-I Wu et al. · 2016 · 20 citations

Engineering, Materials Engineering, Materials Science +17

Development of Non-TSV Interposer (NTI) for High Electrical Performance Package

Fang-Yu Liang, Hung-Hsien Chang, Wen-Tsung Tseng et al. · 2016 · 17 citations

Engineering, Electrical Engineering, Materials Science +17

Development of High-Density Hybrid Substrate for Heterogeneous Integration

Chia-Yu Peng, John H. Lau, Cheng-Ta Ko et al. · 2021 · 16 citations

Engineering, Electrical Engineering, Materials Engineering +17

Intrinsic Advantages of SOI Multiple-Gate MOSFET (MuGFET) for Low Power Applications

Weize Xiong, C. Rinn Cleavelin, Che-Hua Hsu et al. · ECS Transactions · 2007 · 14 citations

Engineering, Electrical Engineering, Materials Science +17