Tony Peng

High-Density Hybrid Substrate for Heterogeneous Integration

Tony Peng, John H. Lau, Cheng-Ta Ko et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 19 citations

Engineering, Device Integration, High-density Hybrid Substrate +19

<title>Characterization of a fiber Bragg grating (FBG)-based palladium tube hydrogen sensor</title>

Yiwu Tang, Tony Peng, James S. Sirkis et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1999 · 18 citations

Engineering, Sensors, Palladium Tube +9

Panel-Level Chip-Scale Package With Multiple Diced Wafers

John H. Lau, Cheng-Ta Ko, Tzyy-Jang Tseng et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 14 citations

Engineering, Wafer Scale Processing, Corresponding Pcb Equipment +16

Characterization of a fiber Bragg grating (FBG) based palladium tube hydrogen sensor

Y. Tang, Tony Peng, S. M. Lee et al. · Optical Fiber Sensors · 1999 · 12 citations

Engineering, Sensors, Palladium Tube +8