Concepedia

Tzyy-Jang Tseng

TT

Statistics

Publications

13

Citations

271

H-Index

12

Active since

2017

Affiliations

Nanya Technology (Taiwan)(Current)

ASM Pacific Technology (China)

National Yang Ming Chiao Tung University

Tzyy-Jang Tseng is an author at Nanya Technology (Taiwan) specializing in engineering, integrated circuit design, and chip packaging.

Publications per year

2017–2023

13

Publications

13

Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration

John H. Lau, Cheng-Ta Ko, Kai-Ming Yang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 46 citations

Engineering, Mechanical Engineering, Heat Transfer +16

Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging

John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 36 citations

Engineering, Materials Engineering, Mechanical Engineering +16

A Comprehensive Study on Stress and Warpage by Design, Simulation and Fabrication of RDL-First Panel Level Fan-Out Technology for Advanced Package

Puru Burce Lin, Cheng-Ta Ko, Wei-Tse Ho et al. · 2017 · 28 citations

Engineering, Computer Engineering, Electrical Engineering +17

High-Density Hybrid Substrate for Heterogeneous Integration

Tony Peng, John H. Lau, Cheng-Ta Ko et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 22 citations

Engineering, Materials Engineering, Materials Science +17

2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration

Gary Chang-Fu Chen, John H. Lau, Channing Cheng-Lin Yang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 22 citations

Engineering, Electrical Engineering, Materials Science +15

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