Jones Yu-Cheng Huang

Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging

John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 32 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration

Gary Chang-Fu Chen, John H. Lau, Channing Cheng-Lin Yang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 21 citations

Engineering, Small Chip, Thin Film Process Technology +21

Fan-Out (RDL-First) Panel-Level Hybrid Substrate for Heterogeneous Integration

John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang et al. · 2021 · 20 citations

Engineering, Panel-level Hybrid Substrate, Device Integration +20

Performance and reliability study of TGV interposer in 3D integration

Tiwei Wei, Qian Wang, Jian Cai et al. · 2014 · 19 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +13

Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill

Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen et al. · Journal of Microelectronics and Electronic Packaging · 2022 · 14 citations · Full text

Engineering, Mechanical Engineering, Wafer Scale Processing +16