Concepedia

Ricky Tsun-Sheng Chou

RT

3

Publications

66

Citations

3

H-Index

2021

Active since

Affiliations

Nanya Technology (Taiwan)(Current)

Ricky Tsun-Sheng Chou is an author at Nanya Technology (Taiwan) specializing in microfabrication, engineering, and electronic packaging.

Top concepts

Publications per year

2021–2022

3

Publications

3

Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging

John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 32 citations

, , +15

Fan-Out (RDL-First) Panel-Level Hybrid Substrate for Heterogeneous Integration

John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang et al. · 2021 · 20 citations

, , +20

Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill

Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen et al. · Journal of Microelectronics and Electronic Packaging · 2022 · 14 citations · Full text

, , +16

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