P. Jansen

Modeling the subthreshold swing in MOSFET's

E.P. Vandamme, P. Jansen, L. Deferm · IEEE Electron Device Letters · 1997 · 43 citations

Device Modeling, Electrical Engineering, Semiconductor Device +12

CMOS compatible wafer scale adhesive bonding for circuit transfer

S. van der Green, M. Rosmeulen, P. Jansen et al. · 2002 · 28 citations

Scale Adhesive Bonding, Electrical Engineering, Circuit Transfer +11

Lithography Options for the 32 nm Half Pitch Node and Beyond

Kurt Ronse, P. Jansen, Roel Gronheid et al. · IEEE Transactions on Circuits and Systems I Regular Papers · 2009 · 26 citations

Optical Materials, Engineering, Electron-beam Lithography +19

Substrate bonding techniques for CMOS processed wafers

Sonja van der Groen, M. Rosmeulen, Kris Baert et al. · Journal of Micromechanics and Microengineering · 1997 · 26 citations

Electrical Engineering, Circuit Transfer, Engineering +14

Practicalities and limitations of scanning capacitance microscopy for routine integrated circuit characterization

R. J. Stephenson, Peter Wolf, Thomas Trenkler et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000 · 21 citations

Engineering, Microscopy, Dc Bias +20