CMOS compatible wafer scale adhesive bonding for circuit transfer

Abstract

Reports on a transfer technique for CMOS circuits based on a newly developed bonding technique, namely wafer scale adhesive bonding using epoxies. The circuit transfer sequence consists of three steps: bonding a CMOS processed SIMOX wafer to a Pyrex glass wafer, thinning the SIMOX wafer down to the buried oxide and exposing the contact pads. A test chip was designed to evaluate the impact of circuit transfer on the device performance. Measurements have shown a slight increase in leakage current and a small change of threshold voltage due to stress induced by the circuit transfer.