2002 · 28 citations · 2 references
EngineeringElectrical EngineeringMicroelectronicsMicrofabricationSemiconductor DevicesAdhesive BondingChip PackagingCmos Circuit DesignComplementary Metal-oxide-semiconductor TechnologyIntegrated Circuit DesignWafer BondingBondingBonding TechniquesDie-to-wafer BondingDirect Wafer BondingThreshold VoltageWafer AdhesionWafer Thinning After BondingWafer-to-wafer Bonding
Reports on a transfer technique for CMOS circuits based on a newly developed bonding technique, namely wafer scale adhesive bonding using epoxies. The circuit transfer sequence consists of three steps: bonding a CMOS processed SIMOX wafer to a Pyrex glass wafer, thinning the SIMOX wafer down to the buried oxide and exposing the contact pads. A test chip was designed to evaluate the impact of circuit transfer on the device performance. Measurements have shown a slight increase in leakage current and a small change of threshold voltage due to stress induced by the circuit transfer.
2
A CMOS Dissolved Wafer Process For Integrated P++ Microelectromechanical Systems
Yogesh B. Gianchandani, K.J. Ma, K. Najafi · Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95 · 2005 · 25 citations
Engineering, Electrical Engineering, Microelectromechanical Systems +16