T. Mii

Bubble-Free Wafer Bonding of GaAs and InP on Silicon in a Microcleanroom

V. Lehmann, Kiyoshi Mitani, R. Stengl et al. · Japanese Journal of Applied Physics · 1989 · 56 citations

Bubble-free Wafer Bonding, Engineering, Silicon On Insulator +17

Characteristics of CMOS device isolation for the ULSI age

A. Bryant, W. Hänsch, T. Mii · 2002 · 56 citations

Low-power Electronics, Electrical Engineering, Engineering +8

Trench storage node technology for gigabit DRAM generations

K.P. Müller, B. Flietner, C. Hwang et al. · 2002 · 26 citations

Engineering, Emerging Memory Technology, Computer Architecture +18

A fully planarized 0.25 μm CMOS technology for 256 Mbit DRAM and beyond

G. Bronner, H. Aochi, M. Gall et al. · 2002 · 25 citations

Engineering, Vlsi Design, Emerging Memory Technology +16

Cost-effective bidirectional chopper-based battery link UPS with common input-output bus line and its control scheme

K. Hirachi, A. Kajiyama, T. Mii et al. · 2002 · 22 citations

Electrical Engineering, Engineering, Power Ic +11