Kiyoshi Mitani

Causes and Prevention of Temperature-Dependent Bubbles in Silicon Wafer Bonding

Kiyoshi Mitani, Volker Lehmann, R. Stengl et al. · Japanese Journal of Applied Physics · 1991 · 86 citations

Engineering, Silicon On Insulator, Bubble Nucleation +16

Bubble-Free Wafer Bonding of GaAs and InP on Silicon in a Microcleanroom

V. Lehmann, Kiyoshi Mitani, R. Stengl et al. · Japanese Journal of Applied Physics · 1989 · 56 citations

Bubble-free Wafer Bonding, Engineering, Silicon On Insulator +17

Formation of interface bubbles in bonded silicon wafers: A thermodynamic model

Kiyoshi Mitani, U. G�sele · Applied Physics A · 1992 · 48 citations

Materials Science, Wafer Scale Processing, Engineering +13

Silicon wafer bonding: chemistry, elasto-mechanics, and manufacturing

R. Stengl, Kiyoshi Mitani, V. Lehmann et al. · 2003 · 18 citations

Materials Science, Bonding Contact, Wafer Scale Processing +11

Implanted Carbon: An Effective Etch‐Stop in Silicon

V. Lehmann, Kiyoshi Mitani, D. Feijóo et al. · Journal of The Electrochemical Society · 1991 · 15 citations

Materials Science, Etch‐rate Measurements, Electronic Devices +11