M. Gall

Statistical analysis of early failures in electromigration

M. Gall, C. Capasso, D. Jawarani et al. · Journal of Applied Physics · 2001 · 63 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +17

Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects

Meike Hauschildt, C. Hennesthal, G. Talut et al. · 2013 · 50 citations

Engineering, Early Failure Population, Growth Phenomena +16

Statistical analysis of electromigration lifetimes and void evolution

Meike Hauschildt, M. Gall, S. Thrasher et al. · Journal of Applied Physics · 2007 · 42 citations

Materials Science, Materials Engineering, Electrical Engineering +14

A fully planarized 0.25 μm CMOS technology for 256 Mbit DRAM and beyond

G. Bronner, H. Aochi, M. Gall et al. · 2002 · 25 citations

Engineering, Vlsi Design, Emerging Memory Technology +16

Analysis of electromigration statistics for Cu interconnects

Meike Hauschildt, M. Gall, S. Thrasher et al. · Applied Physics Letters · 2006 · 24 citations

Electrical Engineering, Electromigration Technique, Engineering +14