Concepedia

S. Thrasher

ST

Statistics

Publications

6

Citations

186

H-Index

6

Active since

2001

Affiliations

The University of Texas at Austin(Current)

Advanced Micro Devices (United States)

Motorola (United States)

S. Thrasher is an author at The University of Texas at Austin specializing in applied physics, engineering, and electronic packaging.

Top concepts

EngineeringApplied PhysicsElectronic PackagingMicroelectronicsElectrical InsulationElectrical EngineeringMaterial SciencePhysicsCorrosionNanoelectronics

Publications per year

2001–2007

6

Publications

6

Microstructural characterization of inlaid copper interconnect lines

Paul R. Besser, Ehrenfried Zschech, Werner Blum et al. · Journal of Electronic Materials · 2001 · 70 citations

Materials Science, Electromigration Technique, Engineering +6

Statistical analysis of electromigration lifetimes and void evolution

Meike Hauschildt, M. Gall, S. Thrasher et al. · Journal of Applied Physics · 2007 · 42 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Analysis of electromigration statistics for Cu interconnects

Meike Hauschildt, M. Gall, S. Thrasher et al. · Applied Physics Letters · 2006 · 24 citations

Electrical Engineering, Electromigration Technique, Engineering +14

Statistical Analysis of Electromigration Lifetimes and Void Evolution for Cu Interconnects

Meike Hauschildt, M. Gall, S. Thrasher et al. · MRS Proceedings · 2004 · 21 citations

Electrical Engineering, Electromigration Technique, Engineering +13

Blech effect in single-inlaid Cu interconnects

S. Thrasher, C. Capasso, Linlin Zhao et al. · 2001 · 17 citations

Electrical Engineering, Electromigration Technique, Engineering +13

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