Meike Hauschildt

Statistics

Publications

Citations

460

H-Index

Active since

2001

Affiliations

The University of Texas at Austin(Current)

GlobalFoundries (Germany)

GlobalFoundries (United States)

Fraunhofer Institute for Nondestructive Testing

Meike Hauschildt is an author at The University of Texas at Austin specializing in electrical engineering, electromigration reliability, and copper interconnects.

Publications per year

2001–2018

Publications

A 22nm FDSOI Technology Optimized for RF/mmWave Applications

Shao-er Ong, Steffen Lehmann, W.H. Chow et al. · 2018 · 144 citations

Engineering, Electrical Engineering, Microelectronics +16

Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects

Meike Hauschildt, C. Hennesthal, G. Talut et al. · 2013 · 52 citations

Engineering, Electrical Engineering, Materials Science +17

Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Linjun Cao, K. J. Ganesh, Lijuan Zhang et al. · Applied Physics Letters · 2013 · 44 citations

Engineering, Electrical Engineering, Materials Engineering +16

Statistical analysis of electromigration lifetimes and void evolution

Meike Hauschildt, M. Gall, S. Thrasher et al. · Journal of Applied Physics · 2007 · 42 citations

Engineering, Electrical Engineering, Materials Science +17

Analysis of electromigration statistics for Cu interconnects

Meike Hauschildt, M. Gall, S. Thrasher et al. · Applied Physics Letters · 2006 · 24 citations

Engineering, Electrical Engineering, Materials Engineering +17

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