Yiu-Ming Cheung

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Qingqian Margie Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 93 citations

Engineering, Electrical Engineering, Materials Science +15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Margie Li Qingqian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 85 citations

Engineering, Computer Engineering, Manufacturing Processes +13

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 48 citations

Engineering, Electrical Engineering, Materials Engineering +17

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, Chieh-Lin Chang, Jhih-Yuan Pan et al. · 2018 · 35 citations

Engineering, Electrical Engineering, Materials Engineering +17

A high throughput and reliable thermal compression bonding process for advanced interconnections

Ming Li, Dewen Tian, Yiu-Ming Cheung et al. · 2015 · 15 citations

Engineering, Materials Engineering, Materials Science +14