Concepedia

Author

Yan Tang

HRL Laboratories (United States)

Also Known As

Tang, Yan., Yan Tang

13

Publications

975

Citations

9

H-Index

33

Concepts

All Affiliations

HRL Laboratories (United States)Teledyne Technologies (United States)
YT

About

Yan Tang is an author at HRL Laboratories (United States) specializing in engineering, electrical engineering, and applied physics.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

8

8

955

2

Electrical Engineering

7

7

940

3

Applied Physics

5

5

855

4

Computer Engineering

1

1

17

5

Physics

1

1

482

Yan Tang

×

9

Publications

966

Citations

9

H-Index

YearCitations

Scaling of GaN HEMTs and Schottky Diodes for Submillimeter-Wave MMIC Applications

K. Shinohara, D. Regan, Yan Tang,

IEEE Transactions on Electron Devices

2013

482

Ultrahigh-Speed GaN High-Electron-Mobility Transistors With <inline-formula> <tex-math notation="LaTeX">$f_{T}/f_{\mathrm {max}}$ </tex-math></inline-formula> of 454/444 GHz

Yan Tang, K. Shinohara, D. Regan,

IEEE Electron Device Letters

2015

291

Ka-Band LNA MMIC's Realized in Fmax > 580 GHz GaN HEMT Technology

M. Micovic, David F. Brown, D. Regan,

2016

52

Novel Asymmetric Slant Field Plate Technology for High-Speed Low-Dynamic R<sub>on</sub> E/D-mode GaN HEMTs

Joel Wong, K. Shinohara, A. Corrion,

IEEE Electron Device Letters

2016

42

High-Speed 501-Stage DCFL GaN Ring Oscillator Circuits

A. Corrion, K. Shinohara, D. Regan,

IEEE Electron Device Letters

2013

33

Self-Aligned AlGaN/GaN FinFETs

David F. Brown, Yan Tang, D. Regan,

IEEE Electron Device Letters

2017

23

Heterogeneously Integrated RF Circuits Using Highly Scaled off-the-Shelf GaN HEMT Chiplets

Florian Herrault, Joel Wong, Yan Tang,

IEEE Microwave and Wireless Components Letters

2020

17

Coded aperture subreflector array for high resolution radar imaging

J.J. Lynch, Florian Herrault, Gabriel Virbila,

2019

15

Metal-Embedded Chiplet Assembly for Microwave Integrated Circuits

Florian Herrault, Joel Wong, D. Regan,

IEEE Transactions on Components Packaging and Manufacturing Technology

2020

11

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