K. Mukai

Promising storage capacitor structures with thin Ta/sub 2/O/sub 5/ film for low-power high-density DRAMs

H. Shinriki, T. Kisu, S. Kimura et al. · IEEE Transactions on Electron Devices · 1990 · 121 citations

Non-volatile Memory, Engineering, Emerging Memory Technology +16

Stress-induced grain boundary fractures in Al–Si interconnects

K. Hinode, N. Owada, Toshirou Nishida et al. · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1987 · 117 citations

Materials Science, Electromigration Technique, Grain Boundaries +14

Hot-electron hardened Si-gate MOSFET utilizing F implantation

Yasushiro Nishioka, K. Ohyu, Yuzuru Ohji et al. · IEEE Electron Device Letters · 1989 · 104 citations

Semiconductors, Materials Science, Electrical Engineering +13

A Novel Planar Multilevel Interconnection Technology Utilizing Polyimide

Ken-ichi Sato, S. Harada, Takumi Kimura et al. · IEEE Transactions on Parts Hybrids and Packaging · 1973 · 80 citations

Engineering, Interconnection Network Architecture, Power Electronics +18

Planar multilevel interconnection technology employing a polyimide

K. Mukai, K. Yamanaka, S. Harada et al. · IEEE Journal of Solid-State Circuits · 1978 · 59 citations

Engineering, Computer Architecture, Interconnection Network Architecture +19