N. Owada

Stress-induced grain boundary fractures in Al–Si interconnects

K. Hinode, N. Owada, Toshirou Nishida et al. · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1987 · 117 citations

Materials Science, Electromigration Technique, Grain Boundaries +14

Abrasive-Free Polishing for Copper Damascene Interconnection

Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma et al. · Journal of The Electrochemical Society · 2000 · 94 citations · Full text

Engineering, Mechanical Engineering, Abrasive Process +16

Control of Photocorrosion in the Copper Damascene Process

Yoshio Homma, Seiichi Kondo, Noriyuki Sakuma et al. · Journal of The Electrochemical Society · 2000 · 50 citations

Engineering, Chemistry, Corrosion Inhibition +17

TDDB improvement in Cu metallization under bias stress

J. Noguchi, N. Ohashi, J. Yasuda et al. · 2002 · 23 citations

Engineering, Corrosion, Electronic Packaging +18

A 0.2-μm bipolar-CMOS technology on bonded SOI with copper metallization for ultra high-speed processors

Takashi Hashimoto, Toshiyuki Kikuchi, Kazuki Watanabe et al. · 2002 · 22 citations

Engineering, Vlsi Design, Computer Architecture +18