N. Ohashi

Abrasive-Free Polishing for Copper Damascene Interconnection

Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma et al. · Journal of The Electrochemical Society · 2000 · 94 citations · Full text

Engineering, Mechanical Engineering, Abrasive Process +16

Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing

Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma et al. · Japanese Journal of Applied Physics · 2000 · 66 citations

Engineering, Mechanical Engineering, Barrier Metal +17

Control of Photocorrosion in the Copper Damascene Process

Yoshio Homma, Seiichi Kondo, Noriyuki Sakuma et al. · Journal of The Electrochemical Society · 2000 · 50 citations

Engineering, Chemistry, Corrosion Inhibition +17

Effect of NH/sub 3/-plasma treatment and CMP modification on TDDB improvement in Cu metallization

J. Noguchi, N. Ohashi, T. Jimbo et al. · IEEE Transactions on Electron Devices · 2001 · 47 citations

Engineering, Chemical Engineering, Corrosion +16

Impact of low-k dielectrics and barrier metals on TDDB lifetime of Cu interconnects

J. Noguchi, T. Saito, N. Ohashi et al. · 2002 · 36 citations

Engineering, Barrier Metal, Interconnect (Integrated Circuits) +17