Noriyuki Sakuma - Concepedia

Author

Noriyuki Sakuma

Hitachi (Japan)

Also Known As

N. Sakuma, Noriyuki SAKUMA, Noriyuki Sakuma

Publications

389

Citations

H-Index

Concepts

All Affiliations

Hitachi (Japan)

About

Noriyuki Sakuma is an author at Hitachi (Japan) specializing in engineering, materials science, and chemical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	366
2	Chemical Engineering	6	6	307
3	Applied Physics	3	3	72
4	Chemistry	3	3	144
5	Health Sciences	1	1	50

Noriyuki Sakuma

Publications

366

Citations

H-Index

Page 1

	Year	Citations
Abrasive-Free Polishing for Copper Damascene Interconnection Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma, Journal of The Electrochemical Society EngineeringMechanical EngineeringAbrasive ProcessSurface TechnologyChemical Engineering	2000	94
Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma, Japanese Journal of Applied Physics EngineeringMechanical EngineeringBarrier MetalChemistryCorrosion Inhibition	2000	66
Effects of Mechanical Parameters on CMP Characteristics Analyzed by Two-Dimensional Frictional-Force Measurement Yoshio Homma, Kikuo Fukushima, Seiichi Kondo, Journal of The Electrochemical Society EngineeringMechanical EngineeringMechanical ParametersMineral ProcessingNanotribology	2003	54
Control of Photocorrosion in the Copper Damascene Process Yoshio Homma, Seiichi Kondo, Noriyuki Sakuma, Journal of The Electrochemical Society EngineeringChemistryCorrosion InhibitionChemical EngineeringCorrosion	2000	50
Stimulated emission of near-infrared radiation by current injection into silicon (100) quantum well Shinichi Saito, Yuji Suwa, H. Arimoto, Applied Physics Letters PhotonicsElectrical EngineeringPhotoluminescenceEngineeringPhysics	2009	32
Copper dry etching with precise wafer-temperature control using Cl2 gas as a single reactant Hisashi Miyazaki, Ken’ichi Takeda, Noriyuki Sakuma, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena EngineeringChemistryChemical DepositionChemical EngineeringWafer Scale Processing	1997	28
Complete-abrasive-free process for copper damascene interconnection S. Kondo, Noriyuki Sakuma, Y. Homma, Materials ScienceMaterials EngineeringChemical EngineeringEngineeringMaterial Processing	2002	15
Design of Perforated Membrane for Low-Noise Capacitive MEMS Accelerometers Atsushi Isobe, Y. Kamada, C. Takubo, IEEE Sensors Journal EngineeringPerforated MembraneMechanical EngineeringMicroelectromechanical SystemsMicroactuator	2019	15
Observation of optical gain in ultra-thin silicon resonant cavity light-emitting diode Shinichi Saito, Noriyuki Sakuma, Yuji Suwa, PhotonicsOptical MaterialsEngineeringPhotoluminescenceOptical Properties	2008	12

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