Noriyuki Sakuma

Abrasive-Free Polishing for Copper Damascene Interconnection

Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma et al. · Journal of The Electrochemical Society · 2000 · 94 citations · Full text

Engineering, Mechanical Engineering, Abrasive Process +16

Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing

Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma et al. · Japanese Journal of Applied Physics · 2000 · 66 citations

Engineering, Mechanical Engineering, Barrier Metal +17

Effects of Mechanical Parameters on CMP Characteristics Analyzed by Two-Dimensional Frictional-Force Measurement

Yoshio Homma, Kikuo Fukushima, Seiichi Kondo et al. · Journal of The Electrochemical Society · 2003 · 54 citations

Engineering, Mechanical Engineering, Mechanical Parameters +24

Control of Photocorrosion in the Copper Damascene Process

Yoshio Homma, Seiichi Kondo, Noriyuki Sakuma et al. · Journal of The Electrochemical Society · 2000 · 50 citations

Engineering, Chemistry, Corrosion Inhibition +17

Stimulated emission of near-infrared radiation by current injection into silicon (100) quantum well

Shinichi Saito, Yuji Suwa, H. Arimoto et al. · Applied Physics Letters · 2009 · 32 citations · Full text

Photonics, Electrical Engineering, Photoluminescence +14