C. H. Yu

Virtual metrology: a solution for wafer to wafer advanced process control

P. T. Chen, S.Y. Wu, Junshien Lin et al. · 2005 · 99 citations

Engineering, Industrial Engineering, Manufacturing Engineering +10

Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking

D.Y. Chen, W.C. Chiou, M.F. Chen et al. · 2009 · 47 citations

Engineering, Computer Engineering, Electrical Engineering +17

Time Dependent Vccmin Degradation of SRAM Fabricated with High-k Gate Dielectrics

J.-C. Lin, A. S. Oates, C. H. Yu · 2007 · 40 citations

Engineering, Computer Engineering, Electrical Engineering +17

The 3rd dimension-More Life for Moore's Law

C. H. Yu · 2006 · 29 citations

Engineering, Electrical Engineering, Microelectronics +16

300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application

Wei‐Chih Lai, Harry Chuang, Chung-Hao Tsai et al. · 2013 · 27 citations

Engineering, Electrical Engineering, Materials Science +16