300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application

Abstract

The first publication on fabrication of a 300 mm size, 50 μm ultra-thin glass interposer is presented. According to measured data and modeling analysis, merits of on-glass inductors and transmission lines outperform those of on-silicon in Q-factor, power dissipation, and power/signal integrity. Glass interposer is a promising building block technology for future hybrid mixed signal heterogeneous chip integration solution.