Wenxin Liao

300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application

Wei‐Chih Lai, Harry Chuang, Chung-Hao Tsai et al. · 2013 · 27 citations

Engineering, Electrical Engineering, Materials Science +16

A manufacturable interposer MIM decoupling capacitor with robust thin high-K dielectric for heterogeneous 3D IC CoWoS wafer level system integration

Wenxin Liao, Chih-Sheng Chang, Shao-chang Huang et al. · 2014 · 22 citations

Engineering, Electrical Engineering, Materials Science +17

3D IC heterogeneous integration of GPS RF receiver, baseband, and DRAM on CoWoS with system BIST solution

Wenxin Liao, H. N. Chen, Kyle Yen et al. · 2013 · 14 citations

Engineering, Computer Engineering, Electrical Engineering +17

A high-performance low-cost chip-on-Wafer package with sub-μm pitch Cu RDL

Wenxin Liao, C.C. Chiang, Wei Wu et al. · 2014 · 11 citations

Engineering, Electrical Engineering, Microelectronics +16