G. J. Leusink

Perspective: New process technologies required for future devices and scaling

Robert D. Clark, Kandabara Tapily, K.H. Yu et al. · APL Materials · 2018 · 192 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Complete band offset characterization of the HfO2/SiO2/Si stack using charge corrected x-ray photoelectron spectroscopy

Eric Bersch, Ming Di, Steven Consiglio et al. · Journal of Applied Physics · 2010 · 132 citations

Natural Sciences, Materials Science, Physics +17

Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

S-A. Chew, Hao Yu, Marc Schaekers et al. · 2017 · 31 citations

Engineering, Electrical Engineering, Materials Science +17

Atomic-Scale Imaging of Polarization Switching in an (Anti-)Ferroelectric Memory Material: Zirconia (ZrO2)

Sarah Lombardo, Christopher T. Nelson, Kisung Chae et al. · 2020 · 28 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Deep learning acceleration in 14nm CMOS compatible ReRAM array: device, material and algorithm co-optimization

Nanbo Gong, Malte J. Rasch, Soon‐Cheon Seo et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 22 citations

Engineering, Computer Engineering, Computer Science +15